Archives: News
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TI spins motors in minutes with sensorless, brushless DC motor drivers
DALLAS (Feb. 20, 2013) – Texas Instruments Incorporated (TI) (NYSE:NASDAQ) today introduced two 3-phase, brushless DC (BLDC) motor drivers that allow designers to spin motors…
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Elliptic Technologies to Exhibit Embedded Silicon Security Solutions Devoted to Content Protection and Networking Applications at RSA Conference 2013
February 20, 2013 – Ottawa, Canada: Elliptic Technologies, a leading provider of complete embedded security and content protection solutions, today announced that the company will exhibit at…
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CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform
MOUNTAIN VIEW, Calif., – February 19, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and…
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Imec Presents Low-Power Chip for Intra-Cardiac Ventricular Fibrillation Detection
San Francisco, USA – February 19, 2013 – Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this…
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Wind River Debuts Patent-Pending Packet Acceleration Technology and Real-Time Traffic Analysis for Intelligent Networks
ALAMEDA, Calif. – Feb. 19, 2013 – Wind River®, a world leader in embedded and mobile software, has introduced patent-pending packet acceleration technology and added a data…
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EMA Releases TimingDesigner 9.3 with New Documentation Graphics and a Multi-Diagram Interface
Rochester, NY (February 19, 2013) – EMA Design Automation (ema-eda.com), one of the world’s largest Electronic Design Automation Value Added Resellers (VARs), today announced a…
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Quick, efficient chip cleans up common flaws in amateur photographs
CAMBRIDGE, Mass. — Your smartphone snapshots could be instantly converted into professional-looking photographs with just the touch of a button, thanks to a processor chip…
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Cavium Introduces TurboDPI™ II for OCTEON® Processors – Takes Deep Packet Inspection (DPI) To the Next Level
San Jose, Calif., January 31, 2012 –Cavium, Inc. (NASDAQ: CAVM), a leading provider of highly integrated semiconductor products that enable intelligent processing for networking, communications and…
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TI introduces the industry’s smallest point-of-load DC/DC converters for harsh environments
DALLAS (Feb. 19, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry’s smallest monolithic point-of-load (POL) DC/DC converters for harsh environments, including…
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congatec paves way to affordable computing with support for Intel® Celeron® Dual-Core processors
San Diego, California, February 19th, 2013 *** congatec, a leading manufacturer of embedded computer modules, introduces Intel® Celeron ® Dual-Core processors with 3rd Generation Intel® Core™ technology…