Archives: News
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Synopsys Design Implementation Tools Receive TSMC 20nm Phase I Certification
MOUNTAIN VIEW, Calif., May 31, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and…
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Xilinx Joins Semiconductor Industry Leaders at ConFab 2012: “Managing the New Economics of Semiconductor Manufacturing”
SAN JOSE, Calif., May 31, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at The ConFab 2012 Conference at The Encore at The Wynn in Las…
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Calypto Leverages Core Technology to Expand Product Portfolio, Announces Catapult Low-Power High-Level Synthesis
SANTA CLARA, Calif., – May 29, 2012 – Calypto® Design Systems, Inc., a leader in Electronic System Level (ESL) hardware design and Register Transfer Level (RTL) low…
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ANSYS Subsidiary’s Customers Present Methodologies for Advanced Low-power, Power Delivery Integrity, Reliability, Chip-Package-System and 3D-IC Design Challenges
ANSYS (NASDAQ: ANSS) subsidiary Apache Design, Inc. will exhibit its industry-leading simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands…
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Mentor Graphics’ Calibre SmartFill Addresses TSMC 20nm Fill Requirements
WILSONVILLE, Ore., May 30, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced TSMC will use the Calibre® SmartFill solution to achieve TSMC’s fill requirements for its…