News – Page 2107 – EEJournal

Apache Sponsors Chip-Packaage-System Workshops at DesignCon

Apache Design, Inc., a subsidiary of ANSYS (NASDAQ: ANSS), today announced it will be sponsoring two complimentaryChip-Package-System (CPS) Workshops during DesignCon, at the Santa Clara Convention Center on…

January 26, 2012

Synopsys Collaborates with Sigrity to Accelerate Signal Integrity Analysis

MOUNTAIN VIEW, Calif., Jan. 25, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and…

January 26, 2012

Digi-Key Corporation Signs Global Distribution Agreement with LEMO

Thursday, January 26, 2012 – THIEF RIVER FALLS, Minn., USA – Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s largest selection of electronic…

January 26, 2012

Compact, low-cost and fast hyperspectral imaging solution

San Francisco, Calif. , and Leuven, Belgium – January 24, 2012 – Today at SPIE Photonics West 2012, imec has demonstrated a hyperspectral camera solution based…

January 25, 2012

Visure Solutions’ IRQA Offers Requirements Engineering Solution for Embedded Systems

Madrid, Spain and Bowie, MA, January 25, 2012–Visure Solutions, the market leader in Requirements Engineering, today announced the release of IRQA Systems Engineering Template, an IRQA…

January 25, 2012

Saelig Introduces Novel Electric Potential Sensor for Non-contact ECG and Gesture Measurements

Pittsford, NY, USA. January 24, 2012: Saelig Company, Inc.announces the availability of theEPIC Sensor (Electric Potential Integrated Circuit), a new, innovative game-changing electric field sensor. This…

January 25, 2012

IAR Systems supports the Infineon XMC4500 high-performance microcontrollers for energy-efficient industrial applications

Uppsala, Sweden—January 25, 2012—IAR Systems® today announced that its embedded software development toolchain IAR Embedded Workbench® now provides support for the new XMC4500 microcontrollers from…

January 25, 2012

Altium releases new range of board-level components in collaboration with STMicroelectronics

Karlsruhe, Germany – 25 January 2012 – Altium , developer of next-generation electronics design software and services, announces the addition of a comprehensive new range of…

January 25, 2012

Mouser Electronics Shipping BeagleBoard.org’s Newest Member of the Pack – BeagleBone

January 25, 2012 – Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced it has stock…

January 25, 2012

Renesas Electronics Announces Low-Loss Silicon Carbide (SiC) Power Device Series Integrating Power Conversion Circuit in a Single Package

TOKYO, Japan, January 24, 2011—Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced the availability of three silicon carbide (SiC) compound power…

January 25, 2012

Archives: News