News – Page 2109 – EEJournal

Cirrus Logic Energy Measurement ICs Offer Lowest Cost Solution While Optimizing Performance for Smart Grid Applications

AUSTIN, Texas – Jan. 24, 2012 – Featuring the highest energy measurement accuracy in the industry, Cirrus Logic Inc.’s (Nasdaq: CRUS) CS5484/80/90 family of analog…

January 24, 2012

Silex Microsystems Joins ENIAC Joint Undertaking Project EPAMO To Develop Advanced RF Solutions for 4G Mobile Systems

Järfälla, Sweden, January 23, 2012 — Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program…

January 24, 2012

Green Hills Software Announces the Next Generation Platform for Smart Energy

SAN ANTONIO, TX — January 24, 2012 — DistribuTECH 2012, Booth 1745 — Green Hills Software, the largest independent vendor of embedded software solutions and…

January 24, 2012

Compact, low-cost and fast hyperspectral imaging solution

San Francisco (USA) and Leuven (Belgium) – At SPIE Photonics West 2012, imec demonstrates a hyperspectral camera solution based on a system-on-chip image sensor with…

January 24, 2012

Ubidyne features world’s first active antenna solution for 700 MHz 4G at Mobile Word Congress

January 24th 2012 – Ubidyne will be featuring its new LTE 700MHz active antenna solution at next month’s Mobile World Congress 2012 in Barcelona. The uB700™ Antenna…

January 24, 2012

Touchstone Semiconductor Launches the New TS6001A, a Low Power, <7ppm/ºC Guaranteed, 2.5V Voltage Reference IC

MILPITAS, Calif. – Jan. 23, 2012 – Touchstone Semiconductor, a developer of high-performance analog integrated circuit solutions,today announced the newest member of its voltage reference family, the…

January 23, 2012

element14 Premier Farnell extends line card to distribute ARM system design solutions in the Americas

23 January 2011 – London, Premier Farnell plc (LSE:pfl), a leading high-service distributor of technology products and solutions, today announced it has entered into an agreement to distribute ARM…

January 23, 2012

Agilent Technologies Introduces Seven High-Power Modules for Modular Power System

SANTA CLARA, Calif., Jan. 17, 2012 – Agilent Technologies Inc. (NYSE: A) today introduced seven high-power modules for its popular N6700 modular power system. The new modules…

January 23, 2012

IAR Systems supplies starter kits for industrial applications-targeted microcontrollers from Toshiba semiconductor

Uppsala, Sweden—January 23, 2012—IAR Systems® today announces the availability of two starter kits for the M360 group of semiconductors from Toshiba. The M360 group is…

January 23, 2012

LSI Expands Strategic Relationship with ARM to Offer Energy-Efficient Multicore Processors for Networking Applications

MILPITAS, Calif., January 23, 2012 – LSI Corporation (NYSE: LSI) today announced an expansion of its long-term strategic relationship with ARM®, a leader in microprocessor intellectual property…

January 23, 2012

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