News – Page 602 – EEJournal

CES 2022: Intrinsic ID Demonstrates Strength and Versatility of PUF Technology for Identification and Security Applications at World’s Biggest Tech Show

SUNNYVALE, Calif., December 7, 2021 – Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) technology for security and authentication applications in embedded systems and…

December 10, 2021

TDK offers hybrid polymer capacitors with considerably enhanced ripple current capability

December 9, 2021 — TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability…

December 10, 2021

element14 Community Offers Holiday Gift Ideas, Projects and Giveaways

Chicago – December 9, 2021: element14, an Avnet community, is bringing good cheer to engineers this year with its annual Maker and Electronics Engineer Wishlist. In addition…

December 10, 2021

STMicroelectronics Drives the Future of EVs and Industrial Applications with New Silicon-Carbide Devices

ST’s latest-generation silicon-carbide (SiC) power devices extend leadership in performance and reliability for e-mobility and energy-efficient industry Continued long-term investment in SiC positions ST for…

December 10, 2021

Avery Design Systems Offers Comprehensive Verification Support for the New HBM3 Interface Standard

Tewksbury, MA – December 8, 2021 – Avery Design Systems, a leader in functional verification solutions, today announced comprehensive support for the new HBM3 interface standard. Rambus…

December 10, 2021

Point One Navigation and Quectel Bring Precise Location to Robotics and Agriculture Markets

San Francisco, December 9, 2021 –Point One Navigation, a leader in precision location technology, and Quectel Wireless Solutions, a global supplier of IOT modules and antennas, today…

December 9, 2021

Industrial Smart-Sensor Evaluation Kit from STMicroelectronics Accelerates Design with IO-Link Transceiver and STM32 MCU

Geneva, December 8, 2021 – Featuring a slim, 45.8mm x 8.3mm main board, the STMicroelectronics STEVAL-IOD04KT1 industrial-sensor kit simplifies the development of compact IO-Link (IEC 61131-9) sensors for…

December 9, 2021

NI and Silicon Catalyst Partner to Empower Startup Company Innovations

Silicon Valley, CA and Austin, TX, December 8, 2021 – Silicon Catalyst, the world’s only incubator focused exclusively on accelerating semiconductor solutions announced today that NI…

December 9, 2021

element14 Launches Thermal Switches Design Challenge

Chicago – December 8, 2021: element14, an Avnet Community, is hosting a design challenge around thermal switches (also called thermal sensors) to celebrate the new generation…

December 9, 2021

ADLINK and Pixus Technologies Build a Strategic Partnership to Develop Highly Integrated, SOSA-Aligned OpenVPX System Solutions for Aerospace and Defense Applications

Summary: ● The strategic partnership leverages ADLINK’s more than two decades of experience in rugged embedded computing for mission-critical applications, and Pixus’ deep expertise in…

December 9, 2021

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