News – Page 603 – EEJournal

TDK offers high-precision NTC chips for embedding into IGBT modules

December 8, 2021 TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering…

December 9, 2021

DVCon U.S. 2022 Advance Program Available

Gainesville, FL – December 8, 2021 – The advance program is now available for the 2022 Design and Verification Conference and Exhibition United States (DVCon…

December 9, 2021

Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design

CHANDLER, Ariz., Dec. 08, 2021 (GLOBE NEWSWIRE) — E-mobility and renewable energy systems require power management solutions that drive performance and cost efficiencies in addition…

December 9, 2021

Vishay Intertechnology IHCM Common Mode Choke Offers Low Profile, High Shock and Vibration Resistance for 35 A Commercial Applications

MALVERN, Pa., Dec. 08, 2021 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new IHCM common mode choke for high current commercial…

December 9, 2021

Keysight First to Deliver CTIA Authorized 5G mmWave Over-the-Air Test System

SANTA ROSA, Calif. December 8, 2021 Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate…

December 8, 2021

Sylvac adds advanced connectivity to precision tools using Insight SIP RF modules, enabling Industry 4.0 solutions

Sylvac SA is a family-owned Swiss company based in Yverdon-les-Bains, 30 minutes from Lausanne. Over 50 years, it has developed into a leading manufacturer of…

December 8, 2021

Tellabs FlexSym ONT202 Excels Connecting Wi-Fi and IP Cameras over 10 Gigabit Optical LAN

CARROLLTON, Texas, Dec. 07, 2021 (GLOBE NEWSWIRE) — Tellabs, the leading provider of Passive Optical Network (PON) solutions, announces that Tellabs FlexSym® Optical Network Terminal…

December 8, 2021

Seoul Robotics Introduces First-of-its-Kind LiDAR Deployment Kit

IRVINE, Calif., Dec. 07, 2021 (GLOBE NEWSWIRE) — Seoul Robotics, the first 3D computer vision company to commercialize deep learning AI to power the future of…

December 8, 2021

Lam Research Unveils Syndion GP to Help Chipmakers Meet Demand for Advanced Power Devices

FREMONT, Calif., Dec. 07, 2021 (GLOBE NEWSWIRE) — Lam Research Corp. (NASDAQ: LRCX) today announced Syndion® GP: a new product that provides deep silicon etch…

December 8, 2021

Melexis development kit: effortless contactless current sensing evaluation

Tessenderlo, Belgium, 7 December 2021 – Melexis introduces its latest development kits (DVKs) for current sensor IC evaluation. These DVKs give engineers a real preview…

December 8, 2021

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