News – Page 730 – EEJournal

High Speed Contact from Amphenol Can be used in Harsh Environments

Technical Specifications Bandwidth up to 1.25 GHz Data rate exceeding 2.5 Gbps Maximum voltage rating of 500 Vrms at sea level Available in size 8…

February 24, 2021

Micron Launches Low-Power Memory Qualified for Automotive Safety Applications

BOISE, Idaho, Feb. 24, 2021 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun sampling the industry’s first automotive low-power…

February 24, 2021

Keysight Delivers New Event-Based Power Analysis Software

February 24, 2021 11:00 AM Eastern Standard Time SANTA ROSA, Calif.- Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers…

February 24, 2021

New Evaluation Kit for predictive maintenance enables quick and easy condition monitoring in Smart Buildings

Munich, Germany – 23 February 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new XENSIV™ Predictive Maintenance Evaluation Kit, which was…

February 24, 2021

Imec Pushes Single-Exposure Patterning Capability of 0.33NA EUVL to its Extreme Limits

LEUVEN (Belgium), February 23, 2021 — This week, at the 2021 SPIE Advanced Lithography Conference, imec, a world-leading research and innovation hub in nanoelectronics and…

February 24, 2021

Nations’ Latest BLE 5 IC Powered By CEVA Bluetooth® Low Energy IP

ROCKVILLE, MD, February 23, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Nations Technologies Inc.…

February 24, 2021

Thin film chip resistors available from RS Components deliver elevated reliability in challenging operating environments

LONDON, UK, 23 February 2021 – RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel solutions partner for industrial customers…

February 23, 2021

Interactive Reference Designs are Now Available From Trinamic on Ultra Librarian

Rochester, NY (February 23, 2021)—Ultra Librarian®, (ultralibrarian.com) the world’s largest free cloud-based CAD library provider, today announced its partnership with Trinamic and Cadence to provide…

February 23, 2021

OKdo and Qualcomm give makers and developers easy access to Amazon Voice Services

London, UK, 23 February 2021 – OKdo, the global technology company from Electrocomponents plc, is pleased to announce it is now supplying the Qualcomm® Home…

February 23, 2021

ams partners with ArcSoft to demonstrate complete solution for world-facing 3D dToF sensing in mobile devices

ams dToF technology for world-facing mobile aims to achieve higher range and lower power consumption than other implementations The option to integrate ArcSoft imaging…

February 23, 2021

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