News – Page 731 – EEJournal

Matthew Ballance to Receive Accellera Systems Initiative Technical Excellence Award

Elk Grove, Calif., February 23, 2021 — Accellera Systems Initiative (Accellera) announced today that Matthew Ballance, a member of the Portable Stimulus Working Group and a Product…

February 23, 2021

STMicroelectronics Boosts Security Along with AI and IoT Application Development with STM32MP1 Ecosystem Extensions

Geneva, February 23, 2021 – STMicroelectronics has announced extensions to the broad ecosystem that supports development with STM32MP1* dual-core microprocessors, including new software packages and support for…

February 23, 2021

Microchip Announces Space-Qualified COTS-Based Radiation-Hardened Power Converters

CHANDLER, Ariz., February 23, 2021 – As reliance on communication and weather satellites grows and space research expands in scope and mission, new technology is required…

February 23, 2021

Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package

Nijmegen, February 23 2021: Nexperia, the expert in essential semiconductors, today announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format.…

February 23, 2021

Scalable IoT Security Enabled by EPS Global and Crypto Quantique Strategic Partnership

DUBLIN & LONDON, Feb 22nd, 2021 — EPS Global, a world-leading provider of IC programming and secure provisioning services, and Crypto Quantique, a specialist in…

February 23, 2021

Vishay Intertechnology Increases Resistance Ratios and Operating Voltages for ACAS AT Precision Thin Film Chip Resistor Arrays

MALVERN, Pa. — Feb. 22, 2021 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision…

February 23, 2021

Khronos and EMVA Collaborate to Gather Requirements for Embedded Camera and Sensor API Standards

Beaverton, OR — February 22, 2021 — Today, The Khronos® Group, an open consortium creating graphics and compute interoperability standards, and the European Machine Vision Association (EMVA), the leading European…

February 22, 2021

CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%

GRENOBLE, France – Feb. 22, 2021 – CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated…

February 22, 2021

IAR Systems introduces 64-bit Arm core support in leading embedded development tools

Uppsala, Sweden—February 22, 2021—IAR Systems®, the future-proof supplier of software tools and services for embedded development, proudly presents that its C/C++ development toolchain IAR Embedded…

February 22, 2021

STMicroelectronics Reveals STPay-Mobile Platform, Driving Flexible and Scalable Virtual Ticketing and Payments

STPay-Mobile services connect ST54 secure SoC for mobile devices to contactless ticketing and payment platforms First use case targets transit ticketing, leveraging Snowball’s OnBoard™ platform…

February 22, 2021

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