News – Page 745 – EEJournal

Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance

TAICHUNG, Taiwan and Mountain View, CA– January 26, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology…

January 28, 2021

Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop

Sunnyvale, CA. — January 27, 2020 — Mirabilis Design announces VisualSim VPS, a platform that combines VisualSim hardware model with Gem5 Instruction Set. This integration brings…

January 28, 2021

Renesas Adds New Entry-Line RA2E1 MCU Group to RA Family to Address Cost-Sensitive and Space-Constrained Applications

Düsseldorf, January 27, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its 32-bit RA2 Series microcontrollers (MCUs) with…

January 28, 2021

GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability

SAN JOSE, Calif. and GUANGZHOU, China, Jan. 27, 2021 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, is pleased to announce…

January 27, 2021

Silicon Labs and Edge Impulse Partner to Accelerate Machine Learning Applications

AUSTIN, Texas – Jan. 27, 2021 Silicon Labs (NASDAQ: SLAB), a leading provider of silicon, software and solutions for a smarter, more connected world, and Edge Impulse,…

January 27, 2021

Ansys 2021 R1 Unlocks Unlimited Possibilities for Engineering Teams

Key Highlights With the newly launched Ansys 2021 R1, engineers harness advances in simulation technology together with ever-increasing computing power to drive new levels of…

January 27, 2021

Synopsys Delivers Industry’s First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications

MOUNTAIN VIEW, Calif., Jan. 27, 2021 /PRNewswire/ — Highlights DesignWare Integrity and Data Encryption Security Modules protect data transfers for SoCs using the PCI Express® 5.0 or CXL™…

January 27, 2021

Archives: News

Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance

Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop

Renesas Adds New Entry-Line RA2E1 MCU Group to RA Family to Address Cost-Sensitive and Space-Constrained Applications

GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability

Silicon Labs and Edge Impulse Partner to Accelerate Machine Learning Applications

Ansys 2021 R1 Unlocks Unlimited Possibilities for Engineering Teams

Synopsys Delivers Industry’s First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications

Pasternack Launches New Line of Economical Rubber Duck Antennas

Wind River Studio Powers Mission-Critical Intelligent Systems

New Vishay Intertechnology SMD MLCCs Offer Lead (Pb) Bearing Termination Finishes