News – Page 747 – EEJournal

TE Connectivity’s AMPSEAL 16 high temperature connectors now available

WINSTON – SALEM, N.C. – January 21, 2020 – As an extension of the well-proven and widely known AMPSEAL 16 series, TE Connectivity’s (TE), a…

January 25, 2021

DVCon U.S. 2021 Provides Outstanding Technical Program on Virtual Platform

Gainesville, FL —January 21, 2021 —The 2021 Design and Verification Conference and Exhibition (DVCon) U.S. will be held on a virtual platform with a combination…

January 22, 2021

Integrated Impedance-Matching and Protection IC from STMicroelectronics Simplifies Portable GNSS Receivers

Geneva, January 21, 2021 – STMicroelectronics’ BPF8089-01SC6 RF front-end for Global Navigation Satellite System (GNSS) receivers simplifies design and saves real-estate by integrating the impedance-matching and…

January 22, 2021

Abaco Systems Announces the MAGIC1A, a High Performance Embedded Computer with a Modular, Scalable Approach to System Design and Architecture

HUNTSVILLE, Ala.— January 21, 2021 Abaco Systems, Inc. announces the MAGIC1A, a high performance embedded computer (HPEC) with a modular, scalable approach to system design and…

January 22, 2021

Renesas Introduces Innovative New “Lab on the Cloud” Environment That Provides Instant Access to Popular Application Solutions

TOKYO, Japan, January 21 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its new “Lab on the Cloud”…

January 22, 2021

ROHM Completes Construction of a New Environmentally Friendly Building at its Apollo Chikugo Plant to Expand Production Capacity of SiC Power Devices

Santa Clara, CA and Kyoto, Japan, Jan. 21, 2021 (GLOBE NEWSWIRE) — ROHM recently held an opening ceremony announcing the completion of a new building at their…

January 22, 2021

ADLINK Introduces a Portable PXI Express Chassis with Fast, Versatile Thunderbolt™ 3 Interfaces

Summary: ● ADLINK’s new PXES-2314T is a 4-slot Thunderbolt™ 3 PXI Express chassis that accommodates a wide range of test and measurement applications ● Compact…

January 22, 2021

Avnet Integrated, Schneider Electric and Iceotope Deliver the Industry’s First Commercially Available HPC Micro Data Center Solution Cooled by Integrated Chassis-Level Immersion

PHOENIX – Jan. 21, 2021 – Avnet (Nasdaq: AVT), Schneider Electric and Iceotope have been joined by Lenovo to deploy its Lenovo ThinkSystem SR670 servers in a highly scalable,…

January 22, 2021

CellBounce, a Division of ADT, Uses SiTime MEMS Timing in Cellular Bridge Solution for Home Security

SANTA CLARA, Calif., January 21, 2021 – SiTime Corporation (NASDAQ: SITM), a market leader in MEMS timing, today announced that CellBounce, a division of ADT, has chosen the SiTime…

January 22, 2021

Tigard Easy-to-Use Open Source Hardware Hacking Tool Now Available from Crowd Supply

January 21, 2021 – Crowd Supply, the leading product development platform connecting hardware creators with early adopters and enthusiastic backers, announces the successful launch of Tigard, an…

January 22, 2021

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