News – Page 748 – EEJournal

Ansys Launches HFSS Mesh Fusion, Redefines Product Development by Enabling Design of Entire Systems

PITTSBURGH, PA, January 21, 2021 – Ansys (NASDAQ: ANSS) is helping engineering teams to mesh and solve larger designs than ever with the launch of Ansys HFSS Mesh…

January 21, 2021

Lattice Announces Training Center for Award-Winning FPGAs and Solution Stacks

HILLSBORO, OR – January 20, 2021 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low-power programmable leader, today announced an agreement with Krassin Consulting GmbH to establish the Lattice Education…

January 21, 2021

AVX Releases a New Series of Embedded Wi-Fi Antennas with Operating Frequencies up to 6GHz

FOUNTAIN INN, S.C. (January 21, 2021) – AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, released…

January 21, 2021

First product built on Raspberry Pi-designed silicon – Raspberry Pi Pico – now available from Newark

Newark, an Avnet Company and global distributor of electronic components, products and solutions, has today announced the availability of the first product built on Raspberry Pi-designed…

January 21, 2021

Avnet Integrated, Schneider Electric and Iceotope Deliver the Industry’s First Commercially Available HPC Micro Data Center Solution Cooled by Integrated Chassis-Level Immersion

PHOENIX – Jan. 21, 2021 – Avnet (Nasdaq: AVT), Schneider Electric and Iceotope have been joined by Lenovo to deploy its Lenovo ThinkSystem SR670 servers in a highly scalable,…

January 21, 2021

Pasternack Introduces New Yagi Antennas Designed for RFID, Utility and SCADA Applications

IRVINE, Calif. – Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has just launched a new line…

January 21, 2021

Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology

Siemens today announced that its industry-leading tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new…

January 21, 2021

TDK releases new high-precision, low-profile medical sensors

January 21, 2021 TDK Corporation (TSE: 6762) presents a new range of highly accurate differential pressure sensors (part number B58621V*), designed as printed circuit boards.…

January 21, 2021

Honeywell, Curtiss-Wright Receive EASA Certification for 25-Hour Cockpit Recorder for the Air Transport Market

DAVIDSON, N.C. – January 19, 2021 – Curtiss-Wright Corporation (NYSE: CW) and Honeywell (NYSE: HON) today announced that their 25-hour Cockpit Voice Recorder (CVR) developed for…

January 20, 2021

Renesas Expands RF Portfolio to Cover Complete Signal Chain for Macro Base Stations

Düsseldorf, January 20, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today strengthened its industry-leading RF portfolio for traditional macro base transceiver stations…

January 20, 2021

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