News – Page 971 – EEJournal

New Vishay Intertechnology High Voltage Thick Film Chip Resistors Deliver Power to 1.5 W, Increased Design Flexibility

MALVERN, Pa. — March 4, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of high voltage thick film chip resistors that offer…

March 4, 2019

Cadence Announces Complete, Silicon-Proven LPDDR5 IP Solution

SAN JOSE, Calif., March 4, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced early availability of the complete, silicon-proven Cadence® Denali® Gen2 IP for LPDDR5/4/4X…

March 4, 2019

Pentek’s Jade Architecture Digital I/O XMC Module Now Available

38 pairs of Configurable LVDS Digital I/O Jade Architecture with Xilinx Kintex Ultrascale FPGA offers price, power and processing performance advantages Navigator Design Suite expedites…

March 4, 2019

Industry’s first integrated quad- and dual-channel RF-sampling transceivers enable multiantenna wideband systems

DALLAS (March 4, 2019) – Texas Instruments (TI) (NASDAQ:TXN) today introduced two new RF-sampling transceivers that are the first in the industry to integrate four…

March 4, 2019

CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab

BARCELONA, Spain – #MWC19 – February 26, 2019 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter,…

March 1, 2019

Octasic’s New System-on-Chip DSPs are Optimized for Small Cells, Portable Base Stations and Specialized Handsets

MONTREAL, Canada, 26 February, 2019 – Octasic, the leader in low power wireless and media processing solutions, today announced its latest high performance System-on-Chip (SoC). Incorporating…

March 1, 2019

e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting

February 26th, 2019 – Mont-Saint-Guibert, Belgium: e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources…

March 1, 2019

Offering state of the art RF integration with a combined Bluetooth Low Energy and LoRa Combo module with dual integrated antennas

Sophia Antipolis, France, 26 February 2019 – Following on from the success of its class leading range of Bluetooth Low Energy (BLE) modules, Insight SiP, the…

February 28, 2019

Keysight and MediaTek Demonstrate 5G NR Data Call Using Helio M70 Multi-Mode Modem with Integrated Baseband

SANTA ROSA, Calif., February 22, 2019 Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to…

February 28, 2019

New SCALE-iDriver SiC-MOSFET Gate Driver from Power Integrations Maximizes Efficiency, Improves Safety

San Jose, Calif. – February 26, 2019 – Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium and high-voltage inverter applications, today announced the SIC1182K SCALE-iDriver™, a…

February 28, 2019

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