News – Page 972 – EEJournal

HCC Embedded Launches First Reusable Software Element Developed “Out of Context” for Safety-Critical Systems

Budapest, Hungary – 21 February 2019 – HCC Embedded (HCC), experts in high-quality software components for deeply embedded systems, is setting a new bar for the industry…

February 28, 2019

GCF and 5GAA announce collaboration on the certification and testing of C-V2X technologies

The Global Certification Forum (GCF) and 5G Automotive Association (5GAA) have agreed a collaborative framework under which they will combine their resources and expertise to…

February 28, 2019

New smart health sensor from ams brings medical-grade1 cardiovascular monitoring capability to mobile consumer devices

Premstaetten, Austria (27 February, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today introduces the AS7026, an optical sensor for continuous…

February 28, 2019

Hex Five and wolfSSL Announce the First Secure IoT Stack for RISC-V

wolfSSL, a leading provider of TLS cryptography and Hex Five Security, provider of MultiZoneTM Security, the first Trusted Execution Environment for RISC-V announce general availability…

February 28, 2019

Rohde & Schwarz launches world’s first test solution for Bluetooth® 5.1

Munich, February 26, 2019 — With the new Bluetooth® core specification version 5.1 (BT 5.1), Bluetooth® Low Energy (BLE) devices can optionally offer improved navigation…

February 28, 2019

STMicroelectronics and Virscient Collaborate to Enable Faster Delivery of Connected-Car Systems with Telemaco3P Automotive Application Processors

Nuremberg, Germany – February 26, 2019 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has joined forces with Virscient, a provider…

February 28, 2019

New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications

SAN JOSE, Calif., February 26, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Tensilica® ConnX B20 DSP IP, the highest-performing DSP in the…

February 27, 2019

Archives: News

HCC Embedded Launches First Reusable Software Element Developed “Out of Context” for Safety-Critical Systems

GCF and 5GAA announce collaboration on the certification and testing of C-V2X technologies

New smart health sensor from ams brings medical-grade1 cardiovascular monitoring capability to mobile consumer devices

Hex Five and wolfSSL Announce the First Secure IoT Stack for RISC-V

Rohde & Schwarz launches world’s first test solution for Bluetooth® 5.1

STMicroelectronics and Virscient Collaborate to Enable Faster Delivery of Connected-Car Systems with Telemaco3P Automotive Application Processors

AVX Announces New Additions to MIL-PRF-39006 QPL

Ultimate Arduino Challenge from Mouser Electronics and Microchip Technology Kicks Off at Embedded World 2019

Red Pitaya launches new high performance STEMlab platform for faster data, larger bandwidth applications

New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications